Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: BAE collaboration agreement - what to expect next?

As stated in the NR:

The current phase of the work will be performed between March 2015 and August 2015.

Key objectives of the collaboration include process transfer, prototype builds and design enablement kit development.

The Company believes that using BAE Systems’ manufacturing and test capabilities will help the Company to build devices that dramatically demonstrate the disruptive nature of the technology


In you opinion what's next? another collaboration agreement? results from the prototype builds? any ideas?

Regards,


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