Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Cookie-- I think there may be some confusion re your post below. The date for the Q&A, at the top, was July 2016. Unless i'm mistaken the intent in July 2016 was to issue the tender by 31 Dec 2016 and install the technology by July 2018. Sorry I can't provide the link. Please confirm my understanding or clarify. Thx. 

 

From the tender  q&a section

The tender for the project is planned to be issued within this year and the

installation of the technology to SCL is planned to be completed within

 two years.

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