New Denselight posting:

Senior R&D Engineer (Photonics Packaging)

Job Objective/s

To develop packaging process and capabilities to meet company’s technology and product roadmap. Aligned to and integrate with in-house manufacturing capabilities and outsource.

Duties and Responsibilities

◦ Design and develop advanced photonics packaging process technology, and renders major contribution in transforming DenseLight inhouse APT operations (Assembly, Packaging & Test Process) to a world-class Hybrid PIC (Photonics Integrated Circuit) manufacturing operation --- of high performance and low cost lasers and transceivers products for the global markets for data-centers interconnects, data-communications and photonics sensors

◦ Perform design and modeling of laser waveguide optics and beam propagation (Zemax - physical optics propagation), and derive physical packaging configuration with design for manufacturing (DFM) parts and process tolerance analysis

◦ Perform thermal and mechanical design and analysis (Solidworks) and derive mechanical and thermal model of assembly configuration, including specification of DFM parts and process requirement and tolerances 

◦ Manage and work with DenseLight team members the development of processes and tools for BOM preparation, assembly and test; including packaging process integration, packaged device functional and reliability tests, and the qualification of developed process/products

◦ To perform advanced packaging project planning and management, project costing, product/process cost-modeling, required documentation, report generation, presentations and communications. 

◦ To participate in new product development introduction projects based on the advanced packaging technology, and to participate in advancing the company photonics packaging technology and capability to meet company technology roadmap

https://www.jobstreet.com.sg/en/job/senior-rd-engineer-photonics-packaging-6100427?fr=21