Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Projections

You don't have to cross your fingers. We have been told how they used DenseLight to develop the platform. And now they are at a stage where we get to receive the benefits. 

Just to recap:

The buyer is a very big fab described as maybe the biggest. But this technology dovetails into multiple silicon photonic platforms. It is the missing ingredient that everyone needs. 

For example if we look at Cisco. They have made (are making) some significant acquisitions to position the company for 400G. The optical module is still missing but they expect to begin commercial delivery of that part in 2020 for 400G. Fits like a glove people. It really does. But just to be clear POET adds that missing ingredient across the board (no  pun intended) and there will be  many companies or better stated the industry  will embrace what POET offers which is  not simply a method to connect optics in a 3d chip  set at the very low cost that industry has demanded but does it  in a way as to optimize the capability and make it very efficient. The separation of thermal signature is biggy. As an example intel has worked for so long to make high data transfer possible in silicon photonics and that means having the ability to perform CWDM. POET has done it on shoe string budget.   

The reveal is going to make everyone take notice. No fear.

Don’t worry about the wait. Sit tight the delays are totally expected and normal. We will be shared information as soon as they can leading up to the official release in the information circular.

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