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Message: 2019 Heterogeneous Integration Roadmap

The 2019 HIR was posted by lu100 in the off topic (nice find). I believe this is our first look at the roadmap. POET lines up very closely with the requirements and represents a solution that addresses the challenges.

 It becomes very apparent that Suresh’s optical interposer design that allows placement of the active optical die at the edge rather than in a stack is the key to overcome both thermal constraints and optical connectivity that industry is looking for. Keeping the electrical and optical dies laterally separated and utilizing the mating features to provide for heat transfer allows for practical thermal control that cannot otherwise be achieved. And it provides the required footprint for modal adjustments needed to minimize insertion loss. Some designs are going as far as utilizing liquid cooling to maintain temperature dependent wavelength stability.

I believe we have a winner here with this POET platform that will provide industry with a runway far into  the future as new active elements are invented.

 Attention team POET: The HIR could provide good PR for POET to demonstrate that it represents a solution for all the challenges that are identified in the report.

https://www.businesswire.com/news/home/20191010005211/en

The 2019 edition of the Heterogeneous Integration Roadmap includes 22 chapters and can be downloaded by visiting https://eps.ieee.org/technology/heterogeneous-integration-roadmap/2019-edition.html

Chapter 9: Integrated Photonics

https://eps.ieee.org/images/files/HIR_2019/HIR1_ch09_photonics.pdf

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