Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Turr, I think QG is referencing that the company has yet to "officially" annouce that a product (the OI, I assume) is actually finished.The process has been spelled out, all the components have been quailfied, now those components will be platform assembled and be torture tested and qualified.

Perhaps an update on that will be part of the Tuesday's CC !

IMO, of course 

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