Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: Any real evidence?

If I may add. 

In Sept 2018 when Dr Lam was identified as a presenter at the Asia Communications and Photonics Conference Hangzhou, China, Oct. 26-29, 2018 I asked what this was about “Advances in PIC - Using DenseLight's HiPP TMPlatform to Deliver Integrated Sensing Optical Engines & Interrogator Systems”.

To paraphrase the response I received which was discussed on this forum at the time.

Both are progressing roughly in parallel, since they utilize the same technology and are often sold to the same customers.  I would refer you to the presentations on our website and in our filings regarding the state of progress on both.

Share
New Message
Please login to post a reply