Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: What are we waiting for?

Pb wrote:

Thomas Mika specifically said to us, that Rockley doesn't have anything that compares to Poet.

I am confused!

No need to be confused. I have heard similar from SV and VR. To elaborate, one fundamental aspect of the POET OI platform is the ability to connect devices with minimal loss (coupling efficiency). This reduces the energy required to produce and move light and minimizes the heat generated. That is a very big deal and was something that VR emphasised. The heat that is generated by the operation of active devices (the laser) is reduced because the power required to transfer that light into the passive elements (in  this  case Rockley’s big silicon waveguides) is reduced while  at the same time isolating the heat signature of  that laser away from the silicon. As we will recall POET has a laser design that efficiently couples into silicon to expand their market into the silicon photonics industry.

But to clarify what TM is driving at. Monolithic silicon which combines photonic functions with electronic functions results in trade-off. The benefits of scaling are lost as photonics requires large dimensional features and greater thermal control to maintain wavelength accuracy while silicon has excelled at producing very high density electronic features at extremely small dimensions. The two do not co-exist at a performance level that can be achieved by separating the material sets of each. High performance silicon and high performance photonics requires the two to be optimized in their own material sets with a separation of heat signature. The POET optical interposer dielectric stack design is the glue that allows both to exist simultaneously at high performance levels.

So yes the POET OI platform enables the highest level of performance to be achieved between the electronic and photonic domains.  The lateral separation of material sets for thermal control requirements of each are a key ingredient required to attain these high levels of performance with independent scaling and optimization being enabled by Suresh’s design.

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