Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Besides the Tier 1

Thanks for reposting this. One key statement:

" Upon successful qualification, we believe we will have an opportunity to gain rapid penetration into key customers and markets, based on both cost and performance."

Presently we are in the the design in phase with our Tier 1, next will be prototype qualification. Is the  time when we hear of this MOU details for upcoming commercialization of the OI? 

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