Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: As a reminder

According to the statement made by TM they have submitted a tender to the TIER 1. So unless you believe he would flat out lie about something like that in a webcast do they not have to have a successful application and a means to enable high volume supply before they could submit a tender?

 

It takes time to move a mountain.

 

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