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Dear Agoracom Family,

I want to thank all of you for your patience with us over the past 48 hours and apologize for what was admittedly a botched launch of our new site.

As you can see, we have reverted back to the previous version of the site while we address multiple forum functionality flaws that inexplicably made their way into the launch.

To this end:

1.We have identified 8 fundamental but easily fixable flaws that will be corrected in the coming week, so that you can continue to use the forums exactly as you've been accustomed to.

2.Additionally we will also be implementing a couple of design improvements to "tighten up" the look and feel of the forums.

Sincerely,

George et al

Message: OIDA Co-Packaging Technologies Workshop
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Good morning

Thank you InThisThinRain
So we understand that Cisco works internally at upgrading their older Silicon-on-Insulator (SOI) Mach–Zehnder interferometer (MZI) modulators.
 He did not say what’s up in external development efforts.

Again Dr. Suresh Venkatesan was instrumental in the development of SOI platform at Global Foundries.

Ok here we go:
 State-of-the-art (2019) integrated modulators used in optical links are:

InP-based electro-absorption modulators, mainly for short-distance communications (up to ~80 km (mostly VCSEL based Laser designs like Nvidia/Mellanox), 


Silicon-based photonic Mach–Zehnder interferometer (MZI) modulators in pluggable modules (QSFP28) for <10 km-link-length interconnections (also in form factor 100GE CLR4, 100GE LR4 or 100GE ER4) 


3. LiNbO3-based MZ is for links over 100 km.

Mach–Zehnder design are the workhorse (Intel used it in it’s first generation Si photonics transceivers. POET too, for the lower speeds 100G & 200G, uses a Mach–Zehnder design, at higher speeds (400G) we'll see.


For exemple Intel is implementing a Silicon Microring Modulator with Integrated Thermo-Optic Resonance Tuning and is confident of being successful.

The race is happening here to, sweet!


Table 1| Comparison of modulators based on different material platforms in regard to Insertion loss performance

Material

 

Insertion loss (dB 

 

 

 

 

LiNbO3 (E)

0.4

 

 

 

 

LiNbO3 (E)+

0.3

 

 

 

 

InGaAsP/InP (E) 

0.7

 

 

 

 

Si photonics

1-2

 

 

 

 

Graphene (T) 

0.1-1.2

 

 

 

 

 

The race is happening here to, sweet, POET has already won the "Flip chip laser integration" can we win modulator race ?

Cheers

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