Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: 2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY & CIRCUITS
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Displaying agenda in event timezone (1:14 PM EDT)

Thursday, June 16th

T12-1 - A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM

1:50 PM-2:15 PM

Description

Authors: S. Venkatesan; J. Lee; S. Goh; B. Pile; D. Meerovich; J. Mo; Y. Jing; L. Soldano; B. Xu*; Z. Yu*; A-Y Thean*; Y. K. Lim*; Poet Technologies; *NUS

A hybrid integration platform for wafer-scale passive flip-chip assembly of electronics and photonics devices using a CMOS-based Optical Interposer is presented. It enables seamless communications between those devices. This platform is the world’s first adapted to directly modulated lasers, enabling the world’s smallest single-chip Transmit/Receive engine for 100G-400G optical engines.

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https://www.vlsisymposium.org/

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