Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: IMEC and Celestial AI at ITF Semicon USA July 10, 2023
https://www.imec-int.com/en/events/deep-tech-dive-usa-de-risking-road-disruption
Deep tech Dive USA:de-risking the road to disruption
Playing a key role within the start-up ecosystem, imec has already helped several deep-tech ventures on the road to success. Deep-tech Dive USA is your chance to explore all aspects of imec’s strategy and activities towards venturing. You will get answers to questions such as:
- What’s imec’s approach to deep-tech venturing and its role in the ecosystem?
- How can imec’s disruptive R&D approach boost the value of young deep-tech ventures?
- Which investment opportunities arise from imec’s ecosystem?
- How does imec.IC-link’s ASIC service support young ventures along their silicon journey?
- Which enabling role does imec.xpand play in funding deep-tech ventures working with imec?
After the presentations and discussions, you’re welcome to join the networking lunch.
In the afternoon, you have the opportunity to join ITF Semicon USA, a unique forum of prime stakeholders from the semiconductor industry. This edition focuses on fueling the industry’s growth through collaboration and workforce development. Registration for ITF Semicon USA can be completed by the Deep-tech Dive USA registration form.
Program
9:00 a.m. – Registration
9:30 a.m. – Welcome by Katrien Marent, EVP & CMO at imec
9:35 a.m. – Building a prime deep-tech venturing hub leveraging the strengths of a global tech leader. Presentation by Olivier Rousseaux - Venture Development Director at imec.
9:55 a.m. – Turning nanotechnology into business. Presentation by Peter Vanbekbergen - Partner at imec.xpand
10:15 a.m. – From idea to product: the journey of deep-tech ventures. Fireside chat moderated by Cyril Vančura - Partner at imec.xpand with Dave Lazovsky - CEO of Celestial AI, Mike Noonen - CEO of Swave Photonics
10:45 a.m. – Coffee break
11:15 a.m. – How imec.IC-link lowers the barrier for start-up companies to develop their own ASIC solution. Presentation by Romano Hoofman - Strategic Development Director at imec.IC-link, imec
11:25 a.m. - ASICs as differentiators for tech start-ups. Panel discussion moderated by Yiyi Wang - Head of imec.IC-link North America with Fabrizio Del Maffeo - CEO of Axelera AI, Cormac Conroy - CEO of TeraSpatial and Puneet Singh - Vice President Engineering of MemryX
12:00 a.m. – Closing remarks by Katrien Marent, EVP & CMO at imec. Followed by networking lunch
13:00 a.m. – Adjourn or opportunity to join ITF Semicon USA
David Lazovsky
Founder, CEO Celestial AI (formerly Inorganic Intelligence) - Venture Partner, Khosla Ventures - Executive Chairman, POET Technologies
In 2004 Mr. Lazovsky founded Intermolecular, a semiconductor and clean energy research, development and Intellectual Property licensing company. He served as the company’s Chief Executive Officer, President and as a member of the board of directors from September 2004 through October 2014. As President and CEO, Mr. Lazovsky led all aspects of the business through its lifecycle from early-stage start-up to public company. Intermolecular (IMI) went public on the NASDAQ in 2011. Mr. Lazovsky has an in-depth knowledge of semiconductor, data/telecommunications, photonics and clean energy industries, as well as extensive international business experience. Mr. Lazovsky previously served as Chairman, Energy Storage Systems (ESS), industry leader in low-cost, long-duration energy storage 2017 - 2018. Prior to Intermolecular, Mr. Lazovsky held several senior management positions at Applied Materials. He was responsible for managing more than $1 billion in Applied Materials’ semiconductor manufacturing equipment business in the Metal Deposition and Thin Films Product Business Groups. Mr. Lazovsky was Ernst & Young Entrepreneur of the Year 2011, Northern California finalist. He holds a Bachelor of Science in mechanical engineering from Ohio University. He currently has over 50 issued and 5 pending U.S. patents.
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