Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: 200G Lanes for 1.6T
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Don't forget the tfln prospects are real and the industry is very excited about that materials properties for "switching light" as Lebby likes to say, still a few years away so EAM definitely is the play for the next while.

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