Engineer

Job Description:

To design and develop 2.5D/3D co-packaged solutions for heterogeneous integration of optics and electronics to meet the company's technology and product roadmap. Candidate will be part of HiPP integration teaftsvm to work with the internal package layout and external process provider to incorporate silicon/TSV, package stack-up, routing and PDN for POET's optical interposer platform.

• Design and develop next generation optical interposers leveraging silicon/TSV and advanced 2/5/3D IC packaging solutions.
• Define package stack-up, routing and PDN requirements for new products.
• Work with external vendors to develop wafer processes and integration for 2.5D/3D heterogeneous integration.
• Manage wafer lot handling and define metrology inspection process control requirements.
• Analyze process data and provide technical feedback to drive product development.
• Manage critical technical deliverables, timeline and provide regular updates to management and stakeholders.
• Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time; and contribute in planning and execution of essential improvement programs.
• Provides documentation & regular technical reporting, and technical support and coordination with the Company NPI teams to fulfil the Company Technology and Product Development programs. Authorities
• Serve as a technical team or task leader, ready to quickly learn new techniques with a passionate R&D mindset
• Interfaces with supplier and internal staff concerning quality and assure that effective corrective action or improvement is implemented

Requirements:

● Electronic packaging knowledge, with knowledge of TSV processing a must. Photonic packaging knowledge is a plus.

● Hand-on experience with die-assembly tool, flip-chip bonder, wire bonder, and CAD drawing is strongly recommended.

● Understanding the packaging of semiconductor wafers is a plus.

● Knowledge of up-to-date production and automation equipment, processes, designs and functions