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Semiconductorization of Photonics using Silicon Optical Interposer

The use of silicon optical interposer as an integration platform enables wafer scale assembly and testing, passive attachment of lasers and other key components, and monolithic integration of elements like MUX, DMUX, and splitters/combiners. The close integration of the electronic and photonic components on a low-loss platform like the Silicon optical interposer improves RF performance, reduces power consumption, and lowers overall assembly cost. Implementation of TSVs on the Optical Interposer Engines eliminates wire bonds and brings true semiconductorization of Photonics to a reality and offers a scalable and cost-efficient solution for large-scale data centers and AI deployments.