Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: 2019 Heterogeneous Integration Roadmap

https://www.businesswire.com/news/home/20191010005211/en


The 2019 edition of the Heterogeneous Integration Roadmap includes 22 chapters and can be downloaded by visiting https://eps.ieee.org/technology/heterogeneous-integration-roadmap/2019-edition.html

Chapter 9: Integrated Photonics

https://eps.ieee.org/images/files/HIR_2019/HIR1_ch09_photonics.pdf

 

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