Good morning Gentlemen

Excellent explanation Guernsey21, thank you for that.

Hengtong Rockley Silicon Photonics Platform :

substrate : silicon-on-insulator (SOI)

Laser source : InP DFB lasers, Flip-chip, 1310nm

Modulators : Mach Zehnder Interferometer (MZI)

Photodetector : Array of high-speed monolithically integrated Ge waveguide PIN photodiodes

Passives devices : waveguides, splitters, Mux & D-Mux are integrated into SOI substrate. 

Fibre attach : V-grooves with integrated spot-size converters and passive-aligned

400G FR4 , reach max. 2km

800G DR8, reach max. 500m

You can see pictures in the following documents

OFC 2021 Brochure

https://www.ofcconference.org/library/exhibits/OFC/2021/pdfs/brochure-9ee59542-a5e7-4e83-88e8-fbe56bc6b2fe.pdf

March 2020 Silicon Photonics Platform info sheet

https://rockleyphotonics.com/wp-content/uploads/2020/03/Rockley-Photonics-Silicon-Photonics-Platform-for-Next-Generation-Transceivers.pdf

Also Mr. Ben Chen was with Accelink at the time POET has signed it’s Memorandum of Understanding (MOU) for the co-development of products with Accelink (March 05, 2018)

Again SOI platforms are no competition - Suresh Venkatesan was instrumental in bringing this technology to market.

Cheers