Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: EPIC PIC Packaging Teleconference today

Morning lumenge


Perfect - we are talking about miniaturization, hybrid integration, sandwich semiconductor technology and high-tech semiconductor manufacturing equipment - please (video 1:33)

Please do transmit and say thank you to proto at IHub.

Cheers

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