Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Very observant!

There are so many 3's...these may not translate to average consumer but thought some of you would appreciate the humour.

3rd party foundry

3" wafers

III-5

3-4 node sizes ahead of silicon

3D packaging

300 mV low core voltage

3 decades of experience

34 patents

9 Recommendations
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