Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Well it may be of some interest to speculate about conference floor space who's who, but the real meat is in Pfl's original post because several engineering questions have been answered therein. For me, the non ambiguous statement built in CWDM filters and also sealed and singulated at wafer-level with true CMOS compatibility. These are the smaller "holy grails" that were required to give life to  and authenticate the OI into the real world and de-risk the concept

Next step, products and customers......

IMO, of course

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