Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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A little more market report exposure for POET.  Like the aforementioned PIC report, not cheap to take a peek inside.

 

Co-Packaged Optics Markets 2021-2025

 

Co-packaged optics markets are is an increasingly attracting technology supporting high-speed optical networks, high-performance computing and storage applications by bringing photonics devices and electronic switching together in a single package to reduce power consumption and thermal effects, while at the same time reducing footprints.

 

This report provides CIR’s assessment  and five-year forecast of the new revenue opportunities created by co-packaged optics with special focus on transceivers for data centers for 400G, 800G and Terabit connectivity.  The report also provides coverage of critical components in the co-packaged optics including novel light sources, substrate materials, etc.  We also discuss the various options for fitting the latest ASICs and transceivers into a single package.

 

The report also contains a review of the organizations that are shaping the co-packaged optics sector including the Co-Packaged Collaboration, OIF and EPIC

 

 

Chapter Five: Profiles

 

5.1 ASE Group

5.2 Broadcom

5.3 Cisco

5.4 Corning

5.5 Facebook

5.6 IBM

5.7 Intel

5.8 Juniper

5.9 Kaiam

5.10 Microsoft

5.11 POET Technologies

5.12 Rain Tree Photonics

5.13 Ranovus

5.14 Rockley Photonics

6.15 Samtec

5.16 Senko

5.17 TE Connectivity

5.18 vario-optics ag

5.19 Rain Tree Photonics

 

 

 

Beyond 400G: The Prospects for 800G, Terabit Pluggables, On-Board Optics, and Co-Packaged Optics

 

The main objective of this 800 Gbps transceivers report is to assess the market potential of optical networking operating at 800G and above. The report is especially focused on technologies coming out of the efforts to build high-speed interfaces based on pluggable optics, on-board optics and co-packaged optics. CIR compared the approaches, discuss their viability and construct roadmaps for each technology.

 

Another key objective for this report is to better understand of the factors driving the need for networking in this space. It looks at the impact of video/streaming media, which has grown to an even greater extent because of COVID-19. 5G and IoT seem certain future bandwidth hogs, but what about virtual reality (VR), augmented reality (AR) and AI? CIR notes that the advent of the 51.2T switching chips will be a key enabler for switching gear with 800G and above ports.

 

The report also analyzes current efforts to deploy 800G in the public network. Here the drivers are almost identical; video, 5G and so on, although 5G is more emphasized. But the players are quite different.

 

Although the technologies we discuss in this report are novel, it provides a quantitative and qualitative forecast of the shipments and revenues they are likely to generate, under different (high-end and low-end). We also provide an appendix to the report providing profiles of leading firms active in this space. Among the companies discussed in this report are Broadcom, Ciena, Cisco, Facebook, Huawei, IBM, Infinera, Intel, Mellanox, Microsoft, Ranovus and Samtec.

 

 

Chapter Five: Is Co-Packaging the Next Big Thing?

 

5.2 Examples of Current Co-packaged Optics Today


5.2.1 IBM

5.2.2 Intel Tofino2 Co-Packaged Switch

5.2.3 Rain Tree Photonics

5.2.4 POET Technologies

5.2.5 Ranovus

5.2.6 Rockley Photonics

 

 


https://cir-inc.com/reports/

 

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