December 17, 2020 - Dr. Venkatesan

Our customers look at what we’re doing and they say “these guys are working on a different, unique, differentiated, easy-to-understand approach to how photonic devices are assembled and packaged.”

But the burden of proof has always been on us to demonstrate across a couple of different applications. And we are slowly getting through these major system-level burdens of proof. For example, “can you do a DML?” Well now we say we can. “Could you do a CW laser with good coupling efficiency?” I think a week ago we presented that we could do that.

So, we’re slowly getting past these critical burden of proof requirements we had on us. Not at the component level… we had done that a year ago.  But now at an assembled, system level. You know there are these hurdles you’ve got to get through. And so these things that we are releasing now are significant advances to our capability because critical burdens of proof at a system level are now getting solved.

Cheers