Re: Intel

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Rainer

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Re: Intel

in response to

Re: Intel

fairchijisback

posted on Jun 13, 2021 07:01PM

Fairchijisback: Hi Rainer you would think there would be no coupling losses between the laser and the PIC circuit due to the heterogeneous wafer bonding but there is. They measure a .5db loss.

Thanks, Fairchij, I stand corrected. So that’s even better from our point of view.

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