Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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AGORACOM NEWS FLASH

Dear Agoracom Family,

I want to thank all of you for your patience with us over the past 48 hours and apologize for what was admittedly a botched launch of our new site.

As you can see, we have reverted back to the previous version of the site while we address multiple forum functionality flaws that inexplicably made their way into the launch.

To this end:

1.We have identified 8 fundamental but easily fixable flaws that will be corrected in the coming week, so that you can continue to use the forums exactly as you've been accustomed to.

2.Additionally we will also be implementing a couple of design improvements to "tighten up" the look and feel of the forums.

Sincerely,

George et al

Message: Intel…competition?
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This appears to be a continuation of what they have been working on for a lot of years. 

"fusing a sliver of InP onto a silicon wafer, creating a single hybrid semiconductor laser chip"

Problems associated with this approach are the dislocations created in the mismatched matrix across the temperature range.

Yield…since the process does not identify known good die the yield associated with failure of lasers drops as the number of lasers are increased.

Silicon is not the best material for optical routing. Far from it.

Thermal control…Thermal signatures of each device are not isolated as they are in the POET platform where channeling is efficiently applied and POET’s platform is athermal and remains highly accurate across a wide temperature range. 

 

The design is complex and is the reason it is taking them so long to bring it.

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