Re: Full presentation transcript

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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The Holk

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Re: Full presentation transcript

in response to

Full presentation transcript

Rainer

posted on Jun 22, 2024 07:25PM

Thanks a lot, Rainer.

This piece made me smile, too:

Particularly with Foxconn, we are working in parallel on both conventional transceivers and solutions for linear pluggable optics, called LPO, which eschews the DSP and saves significant power consumption. We believe LPO will be the future of optical transmission once the kinks are worked out due to the large reduction in power consumption for LPO modules.