Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: International Conference on Photonics & Optoelectronics
Do-Won Kim of Denselight is part of organizing committee and speaking at this conference in Zurich July 15-16.
https://www.meetingsint.com/conferences/photonics
https://d2cax41o7ahm5l.cloudfront.net/mi/pdfs/photonics-2019-22708-conference-program33673.pdf
The agenda indicates Do-Won Kim's title topic/abstract is to be announced:
10:00-10:45
Do-Won Kim
Deputy Director, Denselight Semiconductors Pte Ltd, SingaporeTitle: TBA
Biography:
Do-Won Kim has more than 20 years of R & D experience in both government and industry research institutes. He has six years of experience as a chemical engineering research engineer in polymeric material processing such as polymer composite materials for automotive and interior/exterior uses and thirteen years of experience in optical interconnects technology. His PhD includes 5 years of study of optical interconnects based on optical PCB (OPCB). He also has 5 years of research experience in Silicon photonics device integration, passive/active photonic packaging of optical fiber to photonic IC, optical transmitter/receiver module design and packaging and hardware design for 32-channel WDM-PON system.
Abstract:
To be updated
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