Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Chih Tsang Hung @ DenseLight

 

 

Senior OE R&D Manager

 

Jul 2018 – Present1 year 8 months

Singapore

• Develop flip-chip CWDM DFB+SSC Laser applied in optical interposer
• Flip-chip DML chip for 100G/400G CWDM4 optical transmitter
• 1650nm DFB for telecommunication, test &measurements as well as photonic sensing applications

 

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