Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
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• Develop flip-chip CWDM DFB+SSC Laser applied in optical interposer • Flip-chip DML chip for 100G/400G CWDM4 optical transmitter • 1650nm DFB for telecommunication, test &measurements as well as photonic sensing applications