Denselight to unveil new DPhi technology

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Guernsey21

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Denselight to unveil new DPhi technology

posted on Oct 17, 2020 12:14AM

Denselight's Soma Sankaran and Yee-Loy Lam to present their new trademarked DPhi technology at the Industrial Transformation Asia Pacific 2020 next week, an event sponsored by Hannover Messe.

Live Webinar: USING DPHI™ TECHNOLOGY TO ENABLE EMBEDDED SENSING. Packaging technology that helps transceiver manufacturers to achieve faster Time-to-Market in both Sensing & Datacom (400G/800) space. Hear about how DenseLight’s DPHI™ packaging technology enables agility, allows increased flexibility and helps customers to deliver new efficiencies.

Their DPhi packaging technology and process sounds vaguely familiar:

Denselight InP Fab and Die tests
add in Denselight InP lasers and backend processing
get wafer from foundry partner
wafer-scale assembly, singulation and testing
optical engines assembled on wafer
ready to use optical engine

It's hard to imagine POET is not on-board...

https://www.facebook.com/DenseLight/photos/a.1066318553718998/1280591728958345/?type=3&theater