LASER FOCUS WORLD article *Co-packaging photonics and electronics poses challenges

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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LASER FOCUS WORLD article *Co-packaging photonics and electronics poses challenges

posted on May 30, 2024 11:51AM

https://www.laserfocusworld.com/optics/article/55042908/co-packaging-photonics-and-electronics-poses-challenges

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