https://www.bcg.com/publications/2024/advanced-packaging-is-reshaping-the-chip-industry
Key Takeaways
One of the most significant new concepts in semiconductor design and manufacturing is advanced multichip packaging, which integrates a multitude of components into a single package.
- This transformative approach breaks away from the single chip per package model, improving performance and time to market while reducing manufacturing costs and power consumption.
- Advanced multichip packaging substantially minimizes the semiconductor form factor, making it well suited for mobile devices, automotive computing, and generative artificial intelligence (GenAI).
- Primary changes in chip industry structure will be evident through elevating the role of system design, shifting focus from the front end to the back end, and adapting to greater complexity.
- In this new environment, each segment of the chipmaking ecosystem—including fabless chipmakers, foundries, integrated device manufacturers and outsourced semiconductor assembly and test vendors—will have to alter their business models to remain profitable.
- MAY 20, 2024
By Joseph Fitzgerald, Jan-Hinnerk Mohr, Nadim Sah, Jörg Jeschke, Karl Breidenbach, Nicola Kerschbaumer, Sohini Kar, and Ramiro Palma
READING TIME: 12 MIn
