Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Huawei, Cisco, etc.
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Oz that is a good segue into the other parts that I believe have contributed to the masterful plan by Suresh. Denselight's Quantum Well Intermixing technology. I  believe this  was also a key technology that was important for the development of the OI platform in building the active devices that pair with the OI.

DenseLight is planning to make its chips using a process called "quantum-well intermixing." This enables it to grow a wafer and then modify the electrical and optical properties of selected parts of it using a diffusion process, to create multiple optical devices on the same chip.

Quantum-well intermixing is particularly useful for creating both active and passive devices on the same chip, says DenseLight's CTO Yee-Loy Lam. Passive devices need to be as optically transparent as possible, while active devices need to be absorptive.

 

The alternative to this is "regrowth" -- making a single device, then etching away a pit next to it, and growing new material in the hole. This works, but not very well, in Lam's view, because yields get progressively smaller with each regrowth step. "The beauty of quantum-well intermixing is that you make all the different bandgaps in a single go, so you don't suffer any yield loss," he claims.

By "bandgap," Lam is referring to a material's property that determines at which wavelength it emits light or absorbs it -- below the emission wavelength the material is transparent, above it, it is opaque.

 

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