Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Death blow

I would agree in part. I just don’t see why they needed to do this presentation. Particularly after the inflection point comment, which made it sound much more concrete and positive. It’s sounds as though the presentation was cobbled together last minute and delivered less that confidently. Perhaps TM wasn’t meant to deliver it in the first place? He’s not a tech guy afteall. 

Maybe they thought there was a need to temper expectations before the upcoming conference. I also don’t recall anything being said about the new communication strategy they mentioned in the pre brief NR??

IMO it’s business as usual and not much has changed. Which is why I can't see the need for it. 

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