Oz you can see from that picture at the bottom https://insightlidar.com/ that they are using wirebond packaging which is actually a couple of iterations behind POET.

Wirebond Packages: These were the earliest and still often used form of electronic packages. Each die is individually placed into its package, wire-bonded to the periphery pads and sealed. This package is then placed on a printed circuit board.

POET is actually a couple of generations of improvement beyond this utilizing Wafer Level Chip Scale Packaging.

Wafer Level Chip Scale Package: The MCM trend continued for the better part of a decade but starting in the early 2010s, the continued shrinking of form factor for mobile devices in particular drove the need for significantly more innovation. Instead of first assembling the chip into a package – a process done individually at die scale – the path was to “convert the chip into a package”. In this method, the “package” is effectively created over the die using wafer level processing techniques and this method came to be called Wafer Level Packaging (WLP). The major benefit of WLP is that all package fabrication and testing is done on wafer. The cost of WLP drops as the wafer size increases and as the die shrinks. With integration, and specifically, by embedding multiple die within the same package and with the use of innovative packaging architectures, form factor can be reduced even further. The technical benefits of WLP are numerous, substantiated, and increasingly difficult to ignore: 1) better reliability performance 2) more functionality and higher levels of integration through multi-chip embedding and complex architectures; 3) form factor reduction via innovative architectures; and 4) absence of substrate. For these reasons, the semiconductor industry will witness the substantial and widespread adoption of WLP technologies in the coming years. POET’s Optical Interposer technology provides the equivalent of a wafer level packaging for optical modules and sub-assemblies. The result of utilizing POET’s Optical Interposer technology is the creation of optical modules or sub-assemblies at wafer scale, where by 100’s to 1000’s of complete optical modules are created on a single wafer, bringing the economies of scale of silicon packaging to the world of photonics.