McWitty,

This is about using large electrical interposers to stitch together chips to produce a system (SIP = system in package) of chips larger than the largest chip a fab can produce. It mentions super computing and AI where you need lots of processing and memory close together. Doesn't seem relevant right now as this is about an electronic chip interfacing to another electronic chip through an electric interposer. (future on-chip optics could change this). They need more than one chip can provide so they either spread out on a large 2D interposer or stack chips with 3D interposer.

rogue